Multilayer PCB / CCL / FPC / CCS / HDI .....
Hot Press Lamination Service Manufacturer
Aoshikang Technology Co., Ltd.
Aoshikang Technology Co., Ltd. (hereinafter referred to as “Aoshikang”) adheres to the corporate mission of "Connecting the World, Leading the Future." After 18 years of steady growth, it has now become a joint-stock enterprise consisting of multiple operating entities, which are Aoshikang Technology Co., Ltd. Guangdong SEEGEM Circuit Co., Ltd. and Sundell Technology Co., Ltd. The company was successfully listed on the Main Board of the Shenzhen Stock Exchange on December 1, 2017 (stock code: 002913), with current total assets of about 7.7 billion RMB.
Embracing a management philosophy of "Fairness, Teamwork, Innovation, Attention to Detail," Aoshikang leverages its strengths to attract global industry talent, continuously creating industry-leading performance. Aoshikang has become a trusted PCB manufacturer in China and worldwide. Its products are widely used in data computation and storage, automotive electronics, communications and networking, industrial control and security, consumer market and smart terminals, and more. With business spread across the Asia-Pacific, Europe, and the Americas, Aoshikang is highly recognized by Fortune 500 companies such as Huawei, Lenovo, Foxconn, BYD, Midea, MOBIS, and Samsung.
In 2022, Aoshikang achieved a total operating revenue of 4.567 billion RMB, with an average compound annual growth rate (CAGR) of 19.57% from 2018 to 2022. In 2021, it ranked as the second fastest-growing among the top 40 global PCB companies and first in China. According to the "22nd (2022) List of Major Enterprises in the China Electronic Circuit Industry," Aoshikang ranked 17th in the Comprehensive PCB 100 and 8th in the Domestic PCB 100.
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Henan HuanYuChang Achieves Great Success at KPCA Show 2025
From September 3 to 5, 2025, Henan HuanYuChang Electronic Technology Co., Ltd. participated in the KPCA Show 2025 at the COEX Exhibition Center in Seoul, South Korea. Our booth D205 attracted many visitors and created valuable opportunities to demonstrate our company’s strengths in the field of lamination auxiliary materials.
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Successful Participation at KPCA Show 2025
Henan HuanYuChang Electronic Technology Co., Ltd. is pleased to announce the successful conclusion of our participation at the KPCA Show 2025, held from September 3 to September 5 at the COEX Exhibition Center in Seoul, South Korea. Our booth D205 welcomed numerous industry professionals, partners, and potential clients, making the exhibition a valuable opportunity to showcase our advanced lamination materials.
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HuanYuChang Introduces Advanced Lamination Solutions at THECA 2025
At the Thailand Electronics Circuit Asia 2025 (THECA) exhibition, held from August 20–22 at BITEC Bangkok, Henan HuanYuChang Electronic Technology Co., Ltd. demonstrated how its high-temperature and high-pressure lamination accessories bring real value to PCB and FPC manufacturers.
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Successful Participation of HuanYuChang at THECA 2025 in Bangkok
From August 20 to 22, 2025, Henan HuanYuChang Electronic Technology Co., Ltd. successfully showcased its high-performance lamination accessories for PCB, FPC, and CCL manufacturing at the Thailand Electronics Circuit Asia 2025 (THECA) exhibition, held at BITEC EH 99-100, Bangkok, Thailand (Booth G01).
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Henan HuanYuChang to Exhibit at KPCA Show 2025 in Seoul, South Korea
Henan HuanYuChang Electronic Technology Co., Ltd. will be showcasing our latest high-performance lamination materials at KPCA Show 2025 in Seoul, South Korea, from September 3 to 5, 2025. Visit us at Booth D205 to explore our innovative solutions and potential collaborations!
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Henan HuanYuChang to Exhibit at THECA 2025 in Bangkok, Thailand
Henan HuanYuChang Electronic Technology Co., Ltd. will exhibit at THECA 2025 in Bangkok, showcasing our full range of high-performance lamination materials for PCB/CCL/FPC production. Visit us at Booth G01 to explore cooperation opportunities!
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Specific Applications of cushion Pads in Packaging Substrate Production
In the production process of packaging substrates—precision components with ultra-fine line widths (often ≤30μm) and high-density interconnects—cushion pads play a critical role in safeguarding their structural and functional integrity. Their applications are tailored to the unique vulnerabilities of these substrates, which are prone to damage from mechanical stress, contamination, and thermal mismatch.
Shenzhen Chang Universal Electronics Co., Ltd.
RM 2604, Block A, Xingzhan Square,
South Ring Road, Shajing Street,
Bao'an District, Shenzhen 518125
Contact:Mary
Mob:+86 13788325233
Email: info@pcbpresspad.com